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In spite of a diverse production program the copper/aluminium based heat exchanger forms the heart of our production. Technical equipment is adapted to this fact.

Important Capital Equipment:

  • Fin press
    • 4 press machines
      • 12 line ,2 x 6 line, 1 x 1 line
    • special jigs for fin press (mainly for coolers of power semiconductors, partly also the radiator program)
  • Expanders
    • 3 versions of expanding
      • 2 x hydraulic - so called ball expander
      • 1 x bar (mechanic ) expander  with 2 tubes
      • 1 x horizontal expander with more tubes
  • tube-cutters
  • production of nipples
  • NC cutting machine for sheets NC edging press
  • NC sheet bender
  • Universal automatic programmable drill
  • Standard tool machines (millers, lathes, drills, saws etc.)
  • Other special machines and jigs

Some of the technical principles

  • Fin finishing area
    • expanding with interference of min. 0,4 mm
    • hydraulic expanding for water and steam heaters only
    • mechanically expanded evaporators and condensers with the presence of evaporating oils compatible with compressor oils
    • zinc-plated frames and frames made of stainless steel connected by resistance  spot welding, aluminium and copper frames are usually riveted
    • longer, higher or heavier exchangers are reinforced by brackets
  • final finishing – soldering
    • Cu U-bends 5% Ag solder
    • nipples Cu / Cu  15 % Ag solder
    • nipples Fe / Cu  Ms solder
    • steel headers are soldered by mercury arc or flame
    • copper headers are soldered by 15 % Ag solder
    • collector Caps:
      • screwed, mount
      • smooth ( evaporators, condensers)
    • accessories: de-aerating and dewatering plugs, valves or schraider valves
  • Pressure testing – individual under water test (100 % of production )
    • heaters and coolers, dry air 10 – 31 bar
    • evaporators, condenser, nitrogen 25 – 31 bar (filled a low pressure nitrogen)
  • Surface treatment
    • Steel headers and spot welds are treated with a protective paint (use of other surface treatments such as electrophoresis, powder coating, etc. are not available)


 




















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